| 摘要 |
PROBLEM TO BE SOLVED: To attain improvement in connection to mounted electronic components, with respect to a manufacturing method of a wiring board that includes a process of removing a temporary board, after forming the wiring board on the temporary board, and to provide the wiring board. SOLUTION: Disclosed is the manufacturing method of the wiring board including a process of forming a laminate 30 of wiring layers 18a to 18c, and 20, 20a, and 20b on a support 10 and a process of removing the support 10, wherein a stage of forming a curved-surface recessed portion 13 on a surface of the support 10 at a position corresponding to the formation position of a curved-surface projection connection pad 18 is performed, before performing the stage of forming the laminate 30. COPYRIGHT: (C)2009,JPO&INPIT |
