| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for inspecting a wiring board capable of reforming plane distortion such as warpage or deformation, even when the wiring board is thin or the wiring board has many cutout parts thereon. SOLUTION: Since inspection of the wiring board 3 is performed with the wiring board 3 sandwiched between the upper side, namely, a mask 1a for a component surface and the lower side, namely, a mask 1b for a solder surface, the upper side mask 1a is provided with openings (cutout parts) 2a-2c which are larger than a terminal (inspection point) 12a to be inspected on the component surface of the wiring board 3. The upper-side and lower-side plates sandwich the printed wiring board 3 to be inspected. A measuring part is connected to a probe, and a circuit resistance in a printed wiring board is measured by making a current flow between probes, and by applying a voltage thereto. A storage part stores temporarily operation results of a measured value or the like. A control part performs driving control of a moving mechanism, or a processing for determining whether a resistance value or the like measured by the measuring part is defective, or the like. COPYRIGHT: (C)2009,JPO&INPIT
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