发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor device includes a semiconductor substrate having a first surface in which a light-receiving portion and electrodes are provided. The semiconductor substrate has a penetrating wiring layer connecting the first surface and the second surface. A light-transmissive protective member is disposed on the semiconductor substrate so as to cover the first surface. A gap is provided between the semiconductor substrate and the light-transmissive protective member. A protective film is formed at a surface of the light-transmissive protective member. The protective film has an opening provided at a region corresponding to the light-receiving portion.
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申请公布号 |
US2009079020(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080212754 |
申请日期 |
2008.09.18 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TANIDA KAZUMASA;SEKIGUCHI MASAHIRO;HARADA SUSUMU |
分类号 |
H01L31/00;H01L21/00 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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