EPOXY RESIN COMPOSITION

摘要

Disclosed is an epoxy resin composition suitable for an insulating layer of a multilayer printed wiring board. This epoxy resin composition enables to obtain an insulating layer with excellent flame retardance, which insulating layer has a roughened surface exhibiting high adhesion to a plated conductor even though the roughness degree of the roughened surface after roughening treatment is relatively low. Specifically disclosed is an epoxy resin composition characterized by containing (A) an epoxy resin, (B) an epoxy curing agent, (C) a phenoxy resin and/or a polyvinyl acetal resin, and (D) a phosphorus-containing benzoxazine compound.