| 发明名称 |
ENCAPSULATED OPTICAL PACKAGE |
| 摘要 |
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling. |
| 申请公布号 |
EP1654572(A4) |
申请公布日期 |
2009.03.25 |
| 申请号 |
EP20040738016 |
申请日期 |
2004.07.26 |
| 申请人 |
REFLEX PHOTONIQUE INC./REFLEX PHOTONICS INC. |
发明人 |
ROLSTON, DAVID ROBERT CAMERON;MAJ, TOMASZ;FU, SHAO-WEI |
| 分类号 |
G02B6/12;G02B6/13;G02B6/42 |
主分类号 |
G02B6/12 |
| 代理机构 |
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代理人 |
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