发明名称 |
SPUTTERING TARGET/BACKING PLATE CONJUNCTION ELEMENT |
摘要 |
<p>Provided is a sputtering target/backing plate assembly having a structure such that pure copper is embedded in a backing plate position at the central portion of the target, within sputtering target/copper-zinc alloy backing plate bonded bodies. Consequently, provided is a simple structure of sputtering target/backing plate capable of sufficiently accommodating further high-power sputtering without deteriorating the characteristics of a copper-zinc alloy backing plate that is inexpensive and excels in strength and anti-eddy current characteristics.</p> |
申请公布号 |
EP2039797(A1) |
申请公布日期 |
2009.03.25 |
申请号 |
EP20070742794 |
申请日期 |
2007.05.02 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
ODA, KUNIHIRO;FUKUSHIMA, ATSUSHI |
分类号 |
C23C14/34;H01L21/285 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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