METAL WIRE ROD PLATING INSOLUBLE ANODE AND METAL WIRE ROD PLATING METHOD USING IT

摘要

To provide an insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates 20 are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates 20 are tightened and fixed by through-bolts 40 at a plurality of places along the travel path direction. An conductive spacer 30 is interposed in each gap between the insoluble electrode plates 20 at a tightening part by the through-bolt 40 and also a conductive member 50 is provided so as to contact all the electrode plates 20 and the conductive spacers 30.