Method of gluing chips to a constraint substrate and method of placing a semi-conductor reading circuit under constraint

摘要

The silicon layers (40) are arranged on an adhesive support (41) in an adjacent non-contiguous manner with a space of 40 mu m and 500 mu m between the two neighboring layers. A calibrated drop of adhesive (43) is deposited on each silicon layer. A strained substrate (44) is transferred onto the adhesive, such that the substrate has hollows (48) above the spaces. The chips bonded on the strained substrate are produced by singularizing some portions of the formed assembly. An independent claim is included for method of placing semiconductor reading circuit under strain.