发明名称 Epitaxial filled deep trench structures
摘要 A method of forming and a structure of an electronic device. The method including: forming a trench in a single-crystal semiconductor substrate; forming a dopant diffusion barrier layer on sidewalls and a bottom of the trench; and epitaxially growing a single-crystal semiconductor layer in the trench, the single-crystal semiconductor layer filling the trench, the dopant diffusion barrier layer a barrier to diffusion of semiconductor dopants. Also a power transistor formed by the same method.
申请公布号 US7507631(B2) 申请公布日期 2009.03.24
申请号 US20060428983 申请日期 2006.07.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GREENE BRIAN JOSEPH;HOLT JUDSON ROBERT
分类号 H01L21/336 主分类号 H01L21/336
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