发明名称 |
Ultra-thin die and method of fabricating same |
摘要 |
In accordance with a specific embodiment, a method of processing a semiconductor substrate is disclosed whereby the substrate is thinned, and the dice formed on the substrate are singulated by a common process. Trench regions are formed on a backside of the substrate. An isotropic etch of the backside results in a thinning of the substrate while maintaining the depth of the trenches, thereby facilitating singulation of the die.
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申请公布号 |
US7507638(B2) |
申请公布日期 |
2009.03.24 |
申请号 |
US20040881144 |
申请日期 |
2004.06.30 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
MANCINI DAVID P.;CHUNG YOUNG SIR;DAUKSHER WILLIAM J.;WESTON DONALD F.;YOUNG STEVEN R.;BAIRD ROBERT W. |
分类号 |
H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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