发明名称 Adhesive mount for a leveling device and a leveling device
摘要 A mount for removably mounting a device to a reference surface is provided. The mount includes a thermoplastic hot melt adhesive, and a tab that extends from the adhesive. The adhesive is configured to adhere to the surface and the device when the device is mounted to the surface. The adhesive is also configured to be removed from the surface without damaging the surface by moving the tab in a direction substantially parallel to the surface.
申请公布号 US7506450(B2) 申请公布日期 2009.03.24
申请号 US20060477589 申请日期 2006.06.30
申请人 THE STANLEY WORKS 发明人 SPAULDING JAMES;MURRAY JOHN C.
分类号 G01C15/00;A47G1/17 主分类号 G01C15/00
代理机构 代理人
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