发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device in which a main current flows in a direction of the thickness of a semiconductor substrate, to attain desirable electric characteristics. P type semiconductor regions and N type semiconductor regions are alternately provided with an interval therebetween, both regions in a surface of a second main surface of a semiconductor substrate. Between the P type semiconductor regions and the N type semiconductor regions, trenches formed in the surface of the semiconductor substrate are filled with insulators, thereby forming trench isolation structures. Moreover, a second main electrode is formed in contact with both the P type semiconductor regions and the N type semiconductor regions.
申请公布号 US7504707(B2) 申请公布日期 2009.03.17
申请号 US20040515346 申请日期 2004.12.03
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TOKUDA NORIFUMI;KUSUNOKI SHIGERU
分类号 H01L23/58;H01L29/08;H01L29/739 主分类号 H01L23/58
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