CHEMICAL MECHANICAL POLISHING APPARATUS HAVING MULTI ROTATION PLATENS AND CHEMICAL MECHANICAL POLISHING METHOD USING THE SAME

摘要

A chemical mechanical polishing apparatus and the chemical mechanical polishing method using the apparatus are provided to improve the nonuniform polishing of wafer by using the inside platen of circle type and outside platen of ring type. The chemical mechanical polishing apparatus comprises the inside platen(107), the out outside platen(109), and the first drive unit(105) and the second driver apparatus(106). The inside platen has the shape of circular. The outside platen has the shape of ring type. The outside platen surrounds the surrounding of the inside platen. The first drive unit has the first drive shaft for rotating the inside platen. The second driver apparatus has the second driver axis for rotating the outside platen.