发明名称 Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials
摘要 Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.
申请公布号 US2009065776(A1) 申请公布日期 2009.03.12
申请号 US20080114741 申请日期 2008.05.02
申请人 发明人 SCHER ERIK;MOLESA STEVEN;ROCKENBERGER JOERG;KAMATH ARVIND;MORI IKUO
分类号 H01L29/04;C08L83/00;H01L21/208;H01L29/06;H01L29/16 主分类号 H01L29/04
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