METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a compact and thin semiconductor device and a method of manufacturing the same, in which reliability on electrical conduction of electrodes when mounted and mass-productivity of the semiconductor device are improved.

SOLUTION: This semiconductor device has an island portion 2a loaded with a semiconductor element S and one or more electrode portions 2b. After electrically connecting the semiconductor S loaded on the island portion 2a and the electrode portion 2b to each other, sealing is performed by using a resin so that each of back faces of the island portion 2a and the electrode portions 2b are exposed in the same surface as the bottom surface of a resin layer 4. The island portion 2a and the electrode portions 2b are respectively formed by electroforming into at least double-layer structure of a mounting metal thin film 11 on the back face side and a lead layer 12 integrally laminated on the top surface of the mounting metal thin film 11 so as to eliminate a necessity of plating an exposed surface of the electrode portion for other mounting in a following process, and electric conduction of electrodes in mounting and reliability can be thereby improved.

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