| 摘要 |
PROBLEM TO BE SOLVED: To surely pick up divided individual devices from a tape when dividing a wafer by so-called prior dicing in which the wafer is divided into individual devices while exposing separation grooves from the rear-face side of the wafer by grinding the rear face of the wafer after forming the separation grooves, respectively having a depth equivalent to a finishing thickness of a device, on division-scheduled lines on the surface of the wafer. SOLUTION: A wafer processing method has the following configuration. A wafer W is configured so that a protective member 2 is stuck onto the surface while separation grooves G are exposed from the rear face. The rear face of the wafer divided into devices D is stuck onto an adhesive tape T. The protective member 2 is peeled off from the surface. The adhesive tape T is stretched so as to widen an interval between the devices D adjacent to each other and to pick up the individual devices D. As the adhesive tape T, it is devised to use a tape whose thickness is thinner than that of a dicing tape used during dicing in which a cutting blade penetrates through the surface and rear face of the wafer so as to divide the wafer into devices. COPYRIGHT: (C)2009,JPO&INPIT
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