WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring board wherein bonding force to be required for soldering an electrode of an electronic component such as a semiconductor device to a plurality of terminal pads arrayed on the surface of the wiring board is improved, and to provide a method of manufacturing the wiring board. SOLUTION: In the wiring board 10 having a plurality of soldering terminal pads 20 arranged in an array form on the surface, the terminal pads are respectively formed so that respective plane shapes are regular polygons and the inner centers I of the regular polygons are arrayed vertically and horizontally in a prescribed pitch L. Further, the three-dimensional shape of each pad is formed in a projected shape wherein the center part of the surface is projected. COPYRIGHT: (C)2009,JPO&INPIT