发明名称 |
POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL |
摘要 |
The present invention provides a positive photoresist composition used to form a thick film resist pattern on a support which includes (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by represented by a general formula (I) shown below: [wherein, Y represents an aliphatic cyclic group or an alkyl group which may have a substituent group; n represents either 0 or an integer from 1 to 3; R1 and R2 each independently represents a hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms].
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申请公布号 |
US2009068342(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
US20060915134 |
申请日期 |
2006.03.30 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
SENZAKI TAKAHIRO;MISUMI KOICHI;SAITO KOJI |
分类号 |
B05D5/12;G03F7/09;G03F7/20 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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