发明名称 POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL
摘要 The present invention provides a positive photoresist composition used to form a thick film resist pattern on a support which includes (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by represented by a general formula (I) shown below: [wherein, Y represents an aliphatic cyclic group or an alkyl group which may have a substituent group; n represents either 0 or an integer from 1 to 3; R1 and R2 each independently represents a hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms].
申请公布号 US2009068342(A1) 申请公布日期 2009.03.12
申请号 US20060915134 申请日期 2006.03.30
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SENZAKI TAKAHIRO;MISUMI KOICHI;SAITO KOJI
分类号 B05D5/12;G03F7/09;G03F7/20 主分类号 B05D5/12
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