| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an IC element in which specifications can be made common without increasing constraint being imposed on the IC element, along with a method production thereof and to provide a semiconductor device and its manufacturing process. <P>SOLUTION: The substrate used for fixing an IC element and leading out its pad terminals comprises a plurality of posts 5 arranged in the longitudinal and lateral directions in the plan view, and a connection portion 6 for connecting the plurality of posts 5 at portions between the front and back surfaces thereof wherein a recognition mark 8 for distinguishing from other post is put on a part of the posts 5. The plurality of posts 5 can be utilized as the die pads for mounting the IC element or the external terminals of the IC element, and the plurality of posts 5 can be used properly as the die pads or the external terminals depending on the profile and the size of an IC fixing region being set arbitrarily. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
