| 摘要 |
A ball grid array (BGA) package and its corresponding printed circuit board incorporate an improved escape routing scheme. The substrate includes a plurality of conductive pads (202) having a periphery defined by a predetermined edge pattern (200) forming routing channels (222) therebetween. A plurality of signal lines (204) connected to a subset of the conductive pads extends beyond the periphery through the routing channels. The predetermined pattern may, for example, be a right triangle repeating with a periodicity along the periphery of the array, wherein the right triangle has a first side defined by a number of rows in the array, and a second side, perpendicular to the first, defined by a number of layers in the array. |
