发明名称 Thin gate stack structure for non-volatile memory cells and methods for forming the same
摘要 Embodiments are described for reducing the programming voltage of a memory cell in a memory device. The memory cell includes a channel region extending between first and second diffusion regions formed in a substrate. A tunnel dielectric material is formed over the channel region. A storage medium is formed over the tunnel dielectric material to store electrical charge. The storage medium is disposed between a first interface material and a second interface material, each interface material provides a smoother interface between the storage medium and surrounding dielectric materials. A charge blocking material is formed over the storage medium, followed by a control gate material.
申请公布号 US2009067256(A1) 申请公布日期 2009.03.12
申请号 US20070899644 申请日期 2007.09.06
申请人 MICRON TECHNOLOGY, INC. 发明人 BHATTACHARYYA ARUP;DERDERIAN GARO
分类号 G11C11/34;H01L21/336;H01L29/788 主分类号 G11C11/34
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