| 摘要 |
A flexible optoelectric interconnect includes: an optoelectric film, a driving IC, an optical semiconductor device, a heat dissipation plate and a thermally conductive material. The optoelectric film has an electrical interconnect layer made of a single layer and an optical interconnect layer including an optical waveguide core and an optical waveguide clad. The optoelectric film has a through hole extending from a major surface thereof to a rear surface opposite to the major surface. The driving IC is provided on the major surface of the optoelectric film and electrically connected to the electrical interconnect layer, and provided above the through hole in the optoelectric film. The optical semiconductor device is provided on the major surface of the optoelectric film and driven by the driving IC. The heat dissipation plate is provided on the rear surface of the optoelectric film and covering the through hole such that a part of the through hole is protruded from an outer edge of the driving IC in a view perpendicular to the major surface. The thermally conductive material is provided in the through hole and in contact with the driving IC and the heat dissipation plate.
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