| 发明名称 |
INTELLIGENT INSPECTION BASED ON TEST CHIP PROBE FAILURE MAPS |
| 摘要 |
A method and system for semiconductor wafer inspection is disclosed. Each of a plurality of dies on a wafer may be probed with a probe tool to produce probe data. The probe data may be used to generate one or more non-repeating care areas. An inspection tool may use the non-repeating care areas to perform an inspection of the semiconductor wafer.
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| 申请公布号 |
US2009070055(A1) |
申请公布日期 |
2009.03.12 |
| 申请号 |
US20070853615 |
申请日期 |
2007.09.11 |
| 申请人 |
LONG GARRETT JOHN;OLAKENGIL SAJU FRANCIS;GAUD PRAMOD;ROBERTS JOHN JACOB |
发明人 |
LONG GARRETT JOHN;OLAKENGIL SAJU FRANCIS;GAUD PRAMOD;ROBERTS JOHN JACOB |
| 分类号 |
G06F19/00 |
主分类号 |
G06F19/00 |
| 代理机构 |
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