发明名称 HALO-FREE NON-RECTIFYING CONTACT ON CHIP WITH HALO DIFFUSION
摘要 A semiconductor chip includes a semiconductor substrate having a rectifying contact diffusion and a non-rectifying contact diffusion. A halo diffusion is adjacent the rectifying contact diffusion and no halo diffusion is adjacent the non-rectifying contact diffusion. The rectifying contact diffusion can be a source/drain diffusion of an FET to improve resistance to punch-through. The non-rectifying contact diffusion may be an FET body contact, a lateral diode contact, or a resistor or capacitor contact. Avoiding a halo for non-rectifying contacts reduces series resistance and improves device characteristics. In another embodiment on a chip having devices with halos adjacent diffusions, no halo diffusion is adjacent a rectifying contact diffusion of a lateral diode, significantly improving ideality of the diode and increasing breakdown voltage.
申请公布号 EP1290719(B1) 申请公布日期 2009.03.11
申请号 EP20010931903 申请日期 2001.05.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CULP, JAMES;NAYAK, JAWAHAR;RAUSCH, WERNER;SHERONY, MELANIE;VOLDMAN, STEVEN;ZAMDMER, NOAH
分类号 H01L21/00;H01L27/04;H01L21/822;H01L29/10;H01L29/49;H01L29/739;H01L29/78;H01L29/786;H01L29/861 主分类号 H01L21/00
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