A method of manufacturing the bump is provided to secure enough height of bump by the printing and drying process in many times. The step of forming the bump is as follows. The bump(22) is printed by using the first mask(231). The first mask has the upper side of the metal plate(21) having the first perforation hole(251). The lower bump is dried. The upper bump is printed on the top of the lower bump by using the jig. The second perforation hole is formed in the second mask. The upper bump is dried to form the bump. The jig is the sheet form having the third perforation hole. The third perforation hole is bigger than the second perforation hole.
申请公布号
KR20090025508(A)
申请公布日期
2009.03.11
申请号
KR20070090418
申请日期
2007.09.06
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
MOK, JEE SOO;YOO, JE GWANG;KIM, SUNG YONG;RYU, CHANG SUP