发明名称 POLYIMIDE RESIN AND FILM THEREOF
摘要 A transparent polyimide resin is provided to ensure excellent thermal stability and mechanical property by using a copolymer of 3,3'-diaminophenylsulfone, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride. A transparent polyimide resin comprises the repeating units of the following formula 1a and 1b and the specific viscosity of 0.4 ~ 0.6 dl/g. The polyimide resin is obtained by copolymerizing a di-anhydride component indicated as the following chemical formula 2 and a diamine component indicated as the following chemical formula 3.
申请公布号 KR20090025501(A) 申请公布日期 2009.03.11
申请号 KR20070090403 申请日期 2007.09.06
申请人 KOLON INDUSTRIES, INC. 发明人 PARK, HYO JUN;JUNG, HAK GEE;SONG, SANG MIN;KANG, CHUNG SEOCK;CHANG, JIN HAE
分类号 C08G73/10;C08J5/18 主分类号 C08G73/10
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