| 摘要 |
A package for a laser diode component is described. This comprises a carrier, which has on a front side a mounting region for a laser diode chip or laser diode bar, and at least one holding device, which is arranged on the carrier and has at least one aperture, in which an electrical terminal conductor is held. The holding device is designed for surface mounting. Moreover, a laser diode component with such a package and a method for producing a laser diode component are described. In the method, preferably a plurality of carriers are provided together in an interconnected assembly and are loaded with laser diodes. Subsequently, holding devices each with at least one electrical terminal conductor are fitted on the carriers. |
