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发明名称
Heat dissipation deterrence link for semiconductor manufacture
摘要
申请公布号
USD588079(S1)
申请公布日期
2009.03.10
申请号
US20060270121F
申请日期
2006.12.15
申请人
TOKYO ELECTRON LIMITED
发明人
OKADA MITSUHIRO;FURUSAWA YOSHIKAZU;SUZUKI DAISUKE
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