SEMICONDUCTOR TEST SOCKET DEVICE

摘要

A semiconductor test socket device is provided to reduce the height and size of the semiconductor test socket device by directly inserting a pogo pin and a receptacle coupled with the pogo pin into a substrate. A semiconductor test socket device(100) includes a contact(110) and a substrate(120). The contact includes a pogo pin contacting a ball grid of an IC and a receptacle coupled with the pogo pin. The receptacle has a hollow cylindrical shape. The pogo pin is inserted into the inside of the receptacle. An inserting hole is formed in an upper part of the substrate. The contact is inserted into the inserting hole. The inserting hole has the step hole structure of an upper step hole and a low step hole. An outer circumference of the upper step hole is larger than the outer circumference of the lower step hole. The receptacle coupled with the pogo pin is inserted into the space of the upper step hole. A thin pin pushing the pogo pin is passed through the space of the lower step hole.