发明名称 |
LIGHT EMITTING DIODE PACKAGE HAVING HEAT DISSIPATING SLUGS |
摘要 |
A light-emitting diode package is provided to exposes the first and second dissipating slugs to outside through both sides and the lower surface of the package body and to improve the heat spreader capability of the light-emitting diode package. The first and second dissipating slugs(21,23) are formed with the conductive material and is separated from each other. The package body(25) is combined with the first and second dissipating slugs and supports the first and second dissipating slugs. The light emitting diode die(27) is electrically connected to the first and second dissipating slugs. The first and the second dissipating slugs are exposed through the lower surface and side of the package body to outside. |
申请公布号 |
KR20090024369(A) |
申请公布日期 |
2009.03.09 |
申请号 |
KR20070089351 |
申请日期 |
2007.09.04 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
SEO, TAE WON;LEE, SANG CHUL;JUNG, CHAN SUNG |
分类号 |
H01L33/64;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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