发明名称 Method of fabricating a thin film and metal wiring in a semiconductor device
摘要 A method for forming a thin film of a semiconductor device, which may include at least one of the following steps: Forming a Tantalum Nitride (TaN) film over a semiconductor substrate by atomic layer deposition. Forming a Tantalum (Ta) film by converting at least a portion of a Tantalum Nitride (TaN) film into Tantalum (Ta) by soaking the TaN film in a diluted HNO3 solution.
申请公布号 US7498262(B2) 申请公布日期 2009.03.03
申请号 US20060566034 申请日期 2006.12.01
申请人 DONGBU HITEK CO., LTD. 发明人 BAEK IN-CHEOL;LEE HAN-CHOON
分类号 H01L21/84 主分类号 H01L21/84
代理机构 代理人
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