| 摘要 |
Some embodiments of the invention relate to a method of packaging multiple dice into a semiconducting device. The method includes placing a first capsule that includes a first die onto a front side of a tape substrate, placing a second capsule that includes a second die onto the front side of the tape substrate, filling a recess in a surface of the first capsule with an adhesive and folding the tape substrate to attach the first capsule to the second capsule using the adhesive. The method may further include placing a third capsule that includes a third die onto the front side of the tape substrate such that folding the tape substrate includes positioning the third capsule against a back side of the tape substrate opposite to the second capsule.
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