Epoxy/silicone mixed resin composition and light-emitting semiconductor device

摘要

An epoxy/silicone mixed resin composition comprising (A') an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.