| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be surely fixed to a heat radiation body while reducing mechanical stress transmitted to a semiconductor element when the semiconductor device is fitted to the heat radiation body. SOLUTION: The semiconductor device according to the present invention includes a support electrode (1) having a dished recess portion (14) formed of a bottom wall (11) and a side wall (12) formed cylindrically at an outer peripheral part of the bottom wall (11), a semiconductor element (2) arranged on the bottom wall (11) in the recess portion (14), a lead electrode (3) fixed to the semiconductor element (2), and a resin coating body (4) partially covering the semiconductor element (2) and lead electrode (3). The support electrode (1) is fitted in a mounting hole (22) formed in a metallic heat radiation body (21), and the side wall (12) has a stopper (32) formed at one end (12a) of the side wall (12) to be locked to a one-end peripheral edge portion (21a) of the mounting hole (22) and a lock portion (31) formed at the other end (12b) of the side wall (12) to be locked to an other-end peripheral portion (21b) of the mounting hole (22). COPYRIGHT: (C)2009,JPO&INPIT |
