| 摘要 |
A new adhesive system is presented. It has been discovered that crosslinked polymeric materials may be used both as spacer particles and as filler in adhesives. The adhesives are especially useful for attaching electronic devices where controlled adhesive bond width is required and the devices make use of lead free solder or otherwise require high temperature processing. New methods for selection of suitable material to be used as spacer and filler material are presented.
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