发明名称 |
Halbleitervorrichtung, umfassend als Zwischenschicht-Isolationsfilm einen Film mit niedriger Dielektrizitätskonstante |
摘要 |
<p>A composition comprising a siloxane resin, a silicon compound substantially consisting of silicon, carbon and hydrogen, wherein the number ratio of carbon to silicon atoms forming an -X- bond (wherein X is (C)<SUB>m </SUB>(where m is an integer in the range of from 1 to 3), or a substituted or unsubstituted aromatic group with 9 or less carbon atoms) in the main chain of one molecule is in the range of from 2:1 to 12:1, and a solvent, is subjected to a heat treatment to form a low dielectric constant film. Accordingly, a low dielectric constant film having excellent resistance against chemicals and excellent moisture resistance is provided. A semiconductor integrated circuit having a fast response can be produced by using the film.</p> |
申请公布号 |
DE10164943(B4) |
申请公布日期 |
2009.02.26 |
申请号 |
DE2001164943 |
申请日期 |
2001.11.08 |
申请人 |
FUJITSU LTD. |
发明人 |
NAKATA, YOSHIHIRO;SUZUKI, KATSUMI;SUGIURA, IWAO;YANO, EI |
分类号 |
C08J9/26;H01L21/314;C08K5/00;C08L83/04;C08L83/16;C09D5/25;C09D183/04;C09D183/05;C09D183/16;H01B3/00;H01B3/46;H01L21/312;H01L21/316;H01L21/768;H01L23/522 |
主分类号 |
C08J9/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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