| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling method and a peeling device for peeling a protective tape off a wafer without breaking the wafer having an inner peripheral ground surface and an outer circumferential rib surface formed by grinding an inner peripheral part to a prescribed thickness while leaving an outer circumferential part of the wafer having the protective tape stuck on its surface. SOLUTION: The peeling device for the protective tape 2 which sticks a peeling tape 12 on a surface of the protective tape 2 from the wafer having the inner peripheral ground surface and an outer circumferential rib formed by grinding the inner peripheral part to the prescribed thickness while leaving a rear-surface outer circumference of the wafer 1 having the protective tape 2 stuck on the front surface and peels the protective tape 2 off the wafer surface integrally with the peeling tape 12 is provided with a sticking means for the peeling tape 12 which sticks the peeling tape on the front surface of the protective tape 2, an inner periphery table 6 supporting the inner peripheral ground surface of the wafer 1, and an outer circumference table 8 supporting the outer circumferential rib surface of the wafer 1, wherein while the outer circumference table 8 is configured to move up and down relatively to the inner periphery table 6, the inner periphery table 6 and outer circumference table 8 are configured to horizontally move in one body. COPYRIGHT: (C)2009,JPO&INPIT |
