发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXTERNAL CONNECTION AND SEMICONDUCTOR DEVICE OBTAINED BY MEANS OF SAID METHOD |
摘要 |
A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electrofomiing such that the internal connection electrodes are integrally connected to the support. First ends of the internal connection electrodes integrally connected by the support are connected to the wiring pattern. After the circuit element is resin-sealed, the support is removed so as to separate the internal connection electrodes from one another. Second ends of the internal connection electrodes are used as external connection electrodes on the front face, and external connection electrodes on the back face are connected to the wiring pattern.
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申请公布号 |
US2009050994(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20080259329 |
申请日期 |
2008.10.28 |
申请人 |
KYUSHU INSTITUTE OF TECHNOLOGY |
发明人 |
ISHIHARA MASAMICHI;UEDA HIROTAKA |
分类号 |
H01L31/0232;H01L21/56;H01L23/48;H01L23/495 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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