| 摘要 |
A semiconductor package including memory devices laminated in a logic chip is provided to obtain a high speed input and output characteristic by connecting the memory devices to a serializer/deserializer in parallel. A semiconductor package includes a base substrate(50), a logic chip(60), a first semiconductor chip(110) and a second semiconductor chip(220'). The logic chip is arranged on the base substrate. A first surface(21) and a second surface(22) of the logic chip face each other. The logic chip includes a plurality of first signal terminals(65), a plurality of second signal terminals(67) and a serializer/deserializer(69). A serializer/deserializer is electrically connected to the first and second signal terminals. The first semiconductor chip is adhered to the first surface. The first semiconductor chip is electrically connected to the first signal terminals. The second semiconductor chip is adhered to the second surface. The second semiconductor chip is electrically connected to the second signal terminals. The logic chip includes a substrate region(61) and a circuit region(62). The first surface is positioned in a circuit region. The second surface is positioned in the substrate region. The first signal terminals are arranged in the circuit region. The second signal terminals are arranged in the circuit region. |
