| 摘要 |
A semiconductor device and a manufacturing method thereof are provided to prevent the exfoliation generated from the bonding interface between the solder bump and the semiconductor chip or the substrate. A semiconductor chip(3) is mounted on a substrate(1). The first rinse(4) is filled between the substrate and the semiconductor chip. The second resin(5) is formed on the top of the substrate and is extended from the side of the semiconductor chip towards the marginal edge of substrate.
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