| 摘要 |
A TSB IC punching apparatus and a TSB IC punching method are provided to punch a TAB IC succession body by a press, thereby preventing the TAB IC succession body from drooping when being at a punching position. A press(40) is in vertically movable structure, and descends to punch a TAB IC succession body(10). A punching mold(30) enables the press to punch the TAB IC succession body. A cam(34) makes vertical movement of the punching mold along a horizontal movable surface by a horizontal movable cylinder. The press moves up and down by a cam body having a spiral groove eccentrically combined with a rotational shaft of a motor.
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