A CHIP ON BOARD TYPE LIGHT EMITTING DIODE PACKAGE WHICH IS EASY A REPAIR AND REPAIRING METHOD

摘要

A chip on board type light emitting diode package is provided to improve yield by removing a mounting region including faulty light emitting diode and replace it with good one. In a chip on board type light emitting diode package, a plurality of light emitting diodes(110) is die-bonded on of the substrate(120). The electrode of the substrate is electrically connected by the light emitting diode and metal wire. Substrate comprises a mounting region(A), a cut-out(141) and cut out part(143). The light emitting diode is mounted on mounting regions, and cut-outs are penetrated along with the circumstance of mounting regions. Cut-outs are individually separated from the substrate by cutting of cut out parts.