| 摘要 |
A semiconductor chip receiving tray is provided to prevent a convex part of the upper tray from damaging an active surface of the semiconductor chip received in the lower tray when overlapping the plurality of the semiconductor chip receiving trays by increasing a margin width of the receiving region of the semiconductor chip. A surface of a base plate is divided into a plurality of receiving regions by a convex part(112,114). A rear side of the base plate is divided into the plurality of receiving regions by the convex part. The margin width of the receiving region(1a) for the semiconductor chip is smaller than the margin width of the receiving region(1b) for the semiconductor chip. When the semiconductor chip receiving tray is laminated on the base plate, the receiving regions are overlapped. A first convex part is not faced with a second convex part. The distance between the lower part of the second convex part and the surface of the lower semiconductor chip receiving tray and the distance between the upper part of the second convex and the rear side of the upper semiconductor chip receiving tray are below the thickness of the semiconductor chip.
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