| 摘要 |
A chip device for stacking structure is provided to secure space between two elements and realize effective heat dissipation by arranging two elements in stacking structure with shielding member. A chip element(100) of the stacking structure includes a substrate(110), a first element(120), a shielding member(130), an insulating member(140), and second element(150). The chip element includes parts used for transmitting/ receiving a signal of the wireless bandwidth. A first connection terminal(112) is formed on the substrate including a space for first part element. Electromagnetic wave from the shielding member to the firs element is blocked, and the shielding member seals the first element and fixes it on the substrate, and the second element is fixed on the insulating member.
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