APPARATUS FOR TREATING A SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

摘要

An apparatus for treating substrate and a method thereof are provided to improve process efficiency by performing uniform process about whole area of a semiconductor substrate. A first process is performed about a substrate inside a first chamber(100). A second chamber(200) is coupled in the first chamber. A second process is performed about the substrate inside the second chamber. The substrate inside the first chamber is supported by a first supporting pole(150). The first supporting pole is transferred along with the substrate in between the first chamber and the second chamber. The substrate inside the second chamber is supported by a second supporting pole(250). The second supporting pole is rotated.