| 摘要 |
FIELD: electric engineering. ^ SUBSTANCE: invention relates to electric engineering and may be applied for cooling group of heat-producing elements in printed circuit boards. The technical result of this invention is achieved by manufacturing cooling device, which contacts printed circuit board, from the metal plate. There are holes made on the metal plate surface to fasten it to the printed circuit board. Finning and heat-removing platforms contacting with heat-producing elements are also available on the metal plate surface. The heat-producing elements are conjugated with each other by their cylindrical surfaces and with finning. There are air inlets where cooling device is slightly heated and along the cooling device perimetre. The area where cooling device is heavily heated is provided with air outlets. Their location is where heat-removing platforms pass into finning zone. The profile of cooling device cross section is changed gradually (stepwise) in that point. The size and shape of holes, their number and finning direction are selected based on the condition that to ensure optimal temperature difference between surfaces where air inlets are available and surfaces where air outlets are available. Total area of air inlets is bigger than the total area of air outlets. Maximum size and shape of air inlets and outlets is limited by the condition that the decrease of electromagnetic shielding of printed circuit board heat-producing elements is minimised. ^ EFFECT: effective heat sink from heat-producing element and heat dissipation into environment when forced cooling is unavailable, electromagnetic shielding of heat-producing element when there are dimensional restrictions for cooling device. ^ 3 cl, 3 dwg |
