| 摘要 |
The present invention provides a newly designed testing substrate for solving the problem with respect to fine pitches, and a method of manufacturing the testing substrate. The wiring space within the fine pitch can be enlarged by means of a circuit design with through holes, blind vias and stack vias, in association with process technologies for fine lines, blind vias, buried vias and filling vias. The manufactured testing substrate comprises a resting substrate and a probe base, being applicable to the test for IC's or packaged articles.
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