| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for electronic equipment which cools a heat generating source such as an IC chip or the like and is excellent in heat dissipation effect. SOLUTION: The cooling device 100A for the electronic equipment of this invention uses the heatsink 110 directly or indirectly contacted to the heat generating source 130 such as the IC chip or the like with a number of cooling fins 112... set on a base part 111 at appropriate intervals in the standing position in parallel each other. Cooling air blowout nozzles 121 of a cooling blower device 120 are inserted between a number of cooling fins, and blowout angles of the cooling air blowout nozzles 121 are slanted to the normal line of the heat generating source 130 at the range of 10°to 80°to be able to provide a satisfactory heat dissipation effect. COPYRIGHT: (C)2009,JPO&INPIT
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