| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device capable of quick and efficiently conducting a bump shape-processing and an inspection treatment about an electrical characteristic of a wiring pattern, of efficiently decreasing a facility cost, a foorptint, or the like, and of reducing a time-consuming work of an operator. SOLUTION: A substrate processing device (1) for processing the substrate with a solde bump imparted comprises: a bump shaping part (12) for shaping the solder bump imparted to the substrate; an electrical characteristic inspecting part (11) provided at an upstream side or a downstream side of the bump shaping part (12) in a path for conveying the substrate, for conducting a probe to the solder bump, and for inspecting the electrical characteristic of the wiring pattern provided on the substrate including the solder bump; and a substrate conveying mechanism (15) for conveying the substrate along the path for conveying. COPYRIGHT: (C)2009,JPO&INPIT
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