INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING

摘要

An interconnection element (170, 190) is provided for conductive interconnection with another element (172) having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element (187) having a major surface. A plated metal layer (130, 192) including a plurality of exposed metal posts (130) can project outwardly beyond the major surface (176) of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element (187). The interconnection element typically includes a plurality of terminals (151) in conductive communication with the metal posts. The terminals can be connected through the dielectric element (187) to the metal posts (130). The posts may be defined by plating a metal (122, 124) onto exposed co-planar surfaces of a mandrel (120) and interior surfaces of openings (102) in a mandrel, after which the mandrel can be removed.